Aerospace
KJ-930High-Temperature Putty Adhesive

Product Overview

KJ-930 High-Temperature Putty Adhesive is specifically developed for high-temperature infusion molding in industries such as aerospace and other composite material manufacturing. Made through advanced processes, it is suitable for high-temperature applications. Upon heating, the product becomes sticky and cures through vulcanization, capable of operating at temperatures up to 300°C, with a short-term maximum temperature resistance of up to 330°C. Additionally, it has excellent sealing properties during the curing cycle, and after curing, it can be easily stripped from the mold surface without leaving any residue.

 

Applicable Scope

Used in the aerospace industry and other composite material industries for high-temperature infusion molding processes.
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